IEC-61158-4-11-2007.pdf

IEC 61158-4-11 Edition 1.0 2007-12 INTERNATIONAL STANDARD Industrial communication networks Fieldbus specifications Part 4-11: Data-link layer protocol specification Type 11 elements IEC 61158-4-11:2007(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 01/01/2008 21:18:39 MSTNo reproduction or networking permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright © 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. 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networking permitted without license from IHS -,-,- 2 61158-4-11 © IEC:2007(E) CONTENTS FOREWORD.5 INTRODUCTION.7 1 Scope.8 1.1 General.8 1.2 Specifications8 1.3 Procedures8 1.4 Applicability.9 1.5 Conformance.9 2 Normative references .9 3 Terms, definitions, symbols and abbreviations9 3.1 Reference model terms and definitions9 3.2 Service convention terms and definitions.11 3.3 Terms and definitions12 3.4 Symbols and abbreviations16 4 Overview of the DL-protocol .17 4.1 General.17 4.2 Overview of the medium access control.17 4.3 Service assumed from the PhL18 4.4 DLL architecture19 4.5 Access control machine and schedule support functions .21 4.6 Local parameters, variable, counters, timers .22 5 General structure and encoding of PhIDUs and DLPDU and related elements of procedure.32 5.1 Overview.32 5.2 PhIDU structure and encoding.32 5.3 Common MAC frame structure, encoding and elements of procedure 33 5.4 Elements of the MAC frame.34 5.5 Order of bit transmission .38 5.6 Invalid DLPDU.38 6 DLPDU-specific structure, encoding and elements of procedure.39 6.1 General.39 6.2 Synchronization DLPDU (SYN)39 6.3 Transmission complete DLPDU (CMP) 44 6.4 In-ring request DLPDU (REQ) .45 6.5 Claim DLPDU (CLM) .46 6.6 Command (COM) DLPDU47 6.7 Cyclic data and cyclic data with transmission complete DLPDU (DT) and (DT-CMP)48 6.8 RAS DLPDU (RAS) .49 7 DLE elements of procedure 50 7.1 Overall structure50 7.2 Initialization.51 7.3 Cyclic transmission TX/RX control (CTRC) 52 7.4 Sporadic TX/RX control (STRC) 56 7.5 Access control machine (ACM)59 7.6 Redundancy medium control (RMC) 67 7.7 Serializer and deserializer.74 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 01/01/2008 21:18:39 MSTNo reproduction or networking permitted without license from IHS -,-,- 61158-4-11 © IEC:2007(E) 3 7.8 DLL management protocol.74 Bibliography80 Figure 1 Relationships of DLSAPs, DLSAP-addresses and group DL-addresses13 Figure 2 Basic principle of medium access control.18 Figure 3 Interaction of PhS primitives to DLE.19 Figure 4 Data-link layer internal architecture21 Figure 5 Common MAC frame format for DLPDUs.33 Figure 6 Sporadic DLPDU format34 Figure 7 Structure of FC field.35 Figure 8 Structure of SYN DLPDU.39 Figure 9 Structure of CMP DLPDU44 Figure 10 Structure of the REQ DLPDU.45 Figure 11 Structure of CLM DLPDU 46 Figure 12 Structure of COM DLPDU47 Figure 13 Structure of DT DLPDU.48 Figure 14 Structure of RAS DLPDU.49 Table 18 RAS parameter : 3rd and 4th octets.49 Figure 15 Overall structure of DLL .51 Figure 16 DLE state transition52 Figure 17 State transition diagram of CTRC.54 Figure 18 State transition diagram of STRC.57 Table 29 Primitives exchanged between ACM and RMC 60 Figure 19 State transition diagram of ACM.62 Figure 20 State transition diagram of RMC sending and send arbitration .69 Figure 21 State transition diagram of RMC receiving72 Figure 22 State transition diagram of DLM .77 Table 1 Data-link layer components.20 Table 2 Mandatory DLE-variables and permissible values22 Table 3 Observable variables and their value ranges .23 Table 4 F-type: DLPDU type.35 Table 5 FCS length, polynomials and constants.36 Table 6 PN -parameter: 3rd octet 40 Table 7 CW -parameters: 4th octet40 Table 8 PM parameter40 Table 9 RMSEL parameter .41 Table 10 ST-parameter: 5th octet41 Table 11 Th-parameter: 6th, 7th and 8th octets.41 Table 12 Tm-parameter: 9th and 10th octets 42 Table 13 Ts-parameter: 11th and 12th octets42 Table 14 Tl-parameter: 13th and 14th octets 42 Table 15 LL parameters: 15th to 46th octets 43 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 01/01/2008 21:18:39 MSTNo reproduction or networking permitted without license from IHS -,-,- 4 61158-4-11 © IEC:2007(E) Table 16 CLM parameter: 4th octet .46 Table 17 DT parameter: 3rd and 4th octets 48 Table 18 RAS parameter : 3rd and 4th octets.49 Table 19 Primitives exchanged between DLS-user and CTRC53 Table 20 Primitives exchanged between CTRC and ACM.53 Table 21 Parameters used with primitives exchanged between DLS-user and CTRC .54 Table 22 CTRC state table.55 Table 23 CTRC functions table 56 Table 24 Primitives exchanged between DLS-user and STRC56 Table 25 Primitives exchanged between STRC and ACM.57 Table 26 Parameters used with primitives exchanged between DLS-user and STRC .57 Table 27 STRC state table.58 Table 28 STRC functions table 59 Table 29 Primitives exchanged between ACM and RMC 60 Table 30 Parameters used with primitives exchanged between ACM and RMC 60 Table 31 Primitives exchanged between ACM and CTRC.60 Table 32 Parameters used with primitives exchanged between ACM and CTRC 60 Table 33 Primitives exchanged between ACM and STRC.61 Table 34 Parameters used with primitives exchanged between ACM and STRC.61 Table 35 ACM state table.63 Table 36 ACM function table67 Table 37 Primitives exchanged between ACM and RMC 68 Table 38 Primitives exchanged between RMC and derializer / deserializer.68 Table 39 Primitives exchanged between RMC and Ph-layer.68 Table 40 Parameters between RMC and ACM .69 Table 41 Parameters between RMC and Ph-layer69 Table 42 State table of RMC sending.70 Table 43 State table of RMC send arbitration.71 Table 44 State table for RMC receiving72 Table 45 RMC function table74 Table 46 Primitives exchanged between DLMS-user and DLM.75 Table 47 Parameters used with primitives exchanged between DL-user and DLM75 Table 48 Event-related state change variables.76 Table 49 DLM state table.77 Table 50 DLM function table 79 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 01/01/2008 21:18:39 MSTNo reproduction or networking permitted without license from IHS -,-,- 61158-4-11 © IEC:2007(E) 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INDUSTRIAL COMMUNICATION NETWORKS FIELDBUS SPECIFICATIONS Part 4-11: Data-link layer protocol specification Type 11 elements FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. NOTE Use of some of the associated protocol types is restricted by their intellectual-property-right holders. In all cases, the commitment to limited release of intellectual-property-rights made by the holders of those rights permits a particular data-link layer protocol type to be used with physical layer and application layer protocols in Type combinations as specified explicitly in the IEC 61784 series. Use of the various protocol types in other combinations may require permission from their respective intellectual-property-right holders. IEC draws attention to the fact that it is claimed that compliance with this standard may involve the use of patents as follows, where the xx notation indicates the holder of the patent right: Type 11 and possibly other Types: US 4,930,121 To Network system using token-passing bus with multiple priority levels US 5,414,813 To Direct transfer from a receive buffer to a host in a token-passing type network data transmission system US 6,711,131 To Data transmitting apparatus, network interface apparatus, and data transmitting system IEC takes no position concerning the evidence, validity and scope of these patent rights. The holders of these patent rights have assured IEC that they are willing to negotiate licences under reasonable and non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the holders of these patent rights are registered with IEC. Information may be obtained from: Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 01/01/2008 21:18:39 MSTNo reproduction or networking permitted without license from IHS -,-,- 6 61158-4-11 © IEC:2007(E) To Toshiba Corporation 1-1, Shibaura 1-Chome Minato-ku Tokyo 105-8001, Japan Attention: Intellectual Property Rights Section. Attention is drawn to the possibility that some of the elements of this standard may be the subject of patent rights other than those identified above. IEC shall not be held responsible for identifying any or all such patent rights.