IEC-TR-62572-2-2008.pdf
IEC/TR 62572-2 Edition 1.0 2008-09 TECHNICAL REPORT Fibre optic active components and devices Reliability standards Part 2: Laser module degradation IEC/TR 62572-2:2008(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright © 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester. 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Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- IEC/TR 62572-2 Edition 1.0 2008-09 TECHNICAL REPORT Fibre optic active components and devices Reliability standards Part 2: Laser module degradation INTERNATIONAL ELECTROTECHNICAL COMMISSION U ICS 33.180; 31.260 PRICE CODE ISBN 2-8318-9993-1 ® Registered trademark of the International Electrotechnical Commission Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- 2 TR 62572-2 © IEC:2008(E) CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Terms and definitions .7 4 Laser diode and laser module failure mechanisms8 4.1 General.8 4.2 Description of the main failure mechanisms which affect laser diodes and laser modules9 4.2.1 Laser diodes9 4.2.2 Monitor photodiode13 4.2.3 TEC and thermistor .13 4.2.4 Packaging and optical fibre14 5 Guidance on testing .14 5.1 Service life tests General .14 5.2 Scale of testing .15 5.3 Screening of components (including burn-in).15 5.3.1 Laser diodes15 5.3.2 Monitor photodiode16 5.3.3 Other components of the laser module 16 6 Guidance on the use of failure criteria during testing 16 7 Guidance on reliability predictions 19 7.1 Lifetime predictions .19 7.2 Failure rate prediction .21 Figure 1 An example of cross-section for laser module 9 Figure 2 Cross-section through a typical heterostructure laser (bonded section side up).10 Figure 3 Schematic diagram of DSD and DLDs viewed from the direction perpendicular to the (001) substrate .11 Figure 4 Non-linearities in laser-current characteristics18 Figure 5 “Bathtub” failure rate curve.22 Figure 6 Example of cumulative failure plot showing log-normal distribution of laser failure rate. The sample number tested is 33. .23 Figure 7 Calculate failure rates as a function of service term for components having a log-normal lifetime distribution with a median life of 106 h and dispersion in the range 0,5 to 2,0 23 Table 1 Example of laser diode screening and burn-in conditions 15 Table 2 Example of monitor photodiode screening conditions 16 Table 3 Example of life test failure criteria .17 Table 4 Example of additional failure criteria for laser module service life tests .19 Table 5 Example of failure criteria for laser modules after temperature cycling testing and high-temperature storage testing19 Table 6 Recommended values of activation energy for lifetime predictions (when an experimentally determined value is not available, i.e. default values)21 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- TR 62572-2 © IEC:2008(E) 3 Table 7 Coefficient for upper and lower level of median life in log-normal distribution, (tmp/tmh)1/.26 Table 8 Multiplying coefficient for upper and lower level of dispersion27 Table 9 Failure rate for an exponential lifetime distribution 28 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- 4 TR 62572-2 © IEC:2008(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES RELIABILITY STANDARDS Part 2: Laser module degradation FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 61751-2, which is a technical report, has been prepared by subcommittee 86C: Fibre optic systems and active devices of IEC technical committee 86: Fibre optics, based on the Standard IEC 61751 prepared by subcommittee 47C: Optoelectronic, display and imaging devices, of IEC technical committee 47: Semiconductor devices. The field of this technical report will henceforth be placed under the responsibility of IEC technical committee 86: Fibre optics. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- TR 62572-2 © IEC:2008(E) 5 The text of this technical report is based on the following documents: Enquiry draft Report on voting 86C/833/DTR 86C/847/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62752 series, under the general title Fibre optic active components and devices Reliability standards, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- 6 TR 62572-2 © IEC:2008(E) INTRODUCTION The laser modules covered by this technical report are purchased by a system supplier (SS) to be inserted in equipments which in turn are supplied/sold to a system operator (SO), for example, a telecommunications company (see definitions in Clause 3). For the system operator to act as an informed buyer, knowledge of the potential risks posed by the use of critical components is required. Optoelectronic component technology is continuing to develop. Consequently, during product development phases, many failure mechanisms in laser modules have been identified. These failure mechanisms, if undetected, could result in very short laser lifetime in system use. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- TR 62572-2 © IEC:2008(E) 7 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES RELIABILITY STANDARDS Part 2: Laser module degradation 1 Scope This technical report deals with reliability assessment of laser modules used for telecommunication guidance on testing, use of failure criteria and reliability predictions is provided. This technical report provides guidance on: the testing that a system supplier should ensure is in a place prior to procurement of a laser module from a laser module manufacturer; a range of activities expected of a system supplier to verify a laser module manufacturers reliability claims. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-1: Environmental testing Part 2-1: Tests. Tests A: Cold IEC 60068-2-14: Environmental testing Part 2-14: Tests. Test N: Change of temperature IEC 60747-1: Semiconductor devices Part 1: General IEC 60749-1: Semiconductor devices Mechanical and climatic test methods Part 1: General ISO 9000: Quality management systems Fundamentals and vocabulary MIL-STD-883G: Test method standard, microcircuits 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 laser module packaged assembly containing a laser diode with/without photodiode NOTE The module may also include a cooler and temperature sensor to enable laser temperature to be controlled and monitored. The optical output is normally via an optical fibre pigtail. 3.2 submount substrate upon which a laser is mounted for assembly into the subcarrier Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:33:00 MDTNo reproduction or networking permitted without license from IHS -,-,- 8 TR 62572-2 © IEC:2008(E) 3.3 subcarrier substrate upon w
