半导体集成电路概述.ppt
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1、半导体集成电路,IC常用术语,园片:硅片 芯片(Chip, Die): 6、8 :硅(园)片直径:1 25.4mm 6150mm; 8200mm; 12300mm; 亚微米1m的设计规范 深亚微米=0.5 m的设计规范 0.5 m 、 0.35 m 设计规范(最小特征尺寸) 布线层数:金属(掺杂多晶硅)连线的层数。 集成度:每个芯片上集成的晶体管数,IC工艺常用术语,净化级别:Class 1, Class 10, Class 10,000 每立方米空气中含灰尘的个数 去离子水 氧化 扩散 注入 光刻 .,最小线宽变化,生产工厂简介,PSI,Fab Two was completed Janua
2、ry 2, 1996 and is a “State of the Art“ facility. This 2,200 square foot facility was constructed using all the latest materials and technologies. In this set of cleanrooms we change the air 390 times per hour, if you do the math with ULPA filtration this is a Class One facility. We have had it teste
3、d and it does meet Class One parameters (without any people working in it). Since we are not making microprocessors here and we dont want to wear “space suits“, we run it as a class 10 fab. Even though it consistently runs well below Class Ten.,Here in the Fab Two Photolithography area we see one of
4、 our 200mm .35 micron I-Line Steppers. this stepper can image and align both 6 & 8 inch wafers.,Another view of one of the Fab Two Photolithography areas.,Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties
5、and SemiTool in 1995. Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried).,As we look in this window we see the Worlds First true 300mm production furnace. Our development and design of this tool began in 1992, it was installed in December of 1995 and became f
6、ully operational in January of 1996.,Here we can see the loading of 300mm wafers onto the Paddle.,Process Specialties has developed the worlds first production 300mm Nitride system! We began processing 300mm LPCVD Silicon Nitride in May of 1997.,2,500 additional square feet of “State of the Art“ Cla
7、ss One Cleanroom is currently processing wafers! With increased 300mm & 200mm processing capabilities including more PVD Metalization, 300mm Wet processing / Cleaning capabilities and full wafer 300mm .35um Photolithography, all in a Class One enviroment.,Currently our PS300A and PS300B diffusion to
8、ols are capable of running both 200mm & 300mm wafers. We can even process the two sizes in the same furnace load without suffering any uniformity problems! (Thermal Oxide Only),Accuracy in metrology is never an issue at Process Specialties. We use the most advanced robotic laser ellipsometers and ot
9、her calibrated tools for precision thin film, resistivity, CD and step height measurement. Including our new Nanometrics 8300 full wafer 300mm thin film measurement and mapping tool. We also use outside laboratories and our excellent working relationships with our Metrology tool customers, for addit
10、ional correlation and calibration.,One of two SEM Labs located in our facility. In this one we are using a field emission tool for everything from looking at photoresist profiles and measuring CDs to double checking metal deposition thicknesses. At the helm, another one of our process engineers you
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