JIS-Z-3197-1999-R2004-ENG.pdf
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1、STD-JIS Z 3397-ENGL 3779 I 4933608 0563385 57T JIS JAPANESE I N D U STR IAL STANDARD Translated and Published by Japanese Standards Association Testing methods for soldering fluxes ICs 25.160.50 Descriptors : soldering, fluxes (materials), resins (natural), corrosion tests, sampling methods testing
2、Reference number : JIS Z 3197 : 1999 (E) 29 S Z 3197 : 1999 Foreword This translation has been made based on the original Japanese Industrial Standard revised by the Minister of International Trade and Industry through deliberations at Japanese Industrial Standards Committee in accordance with the I
3、ndustrial Standardization Law. Consequently JIS Z 3197 : 1986 is replaced with JIS Z 3197 : 1999. In this revision, IS0 9455, Soft soldering fluxes-Test methods has been basically employed for the purpose of preparing Japanese Industrial Standard conformed with the International Standards, and this
4、Standard has been made in consideration of domestic technological property at the present time. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, utility model right or application for regist
5、ration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to the public, utility model right or application fo
6、r registration of utility model after opening to the public which have the said technical properties. Date of Establishment: 1972-11-01 Date of Revision: 1999-03-20 Date of Public Notice in Official Gazette: 1999-03-23 Investigated by: Japanese Industrial Standards Committee Divisional Council on We
7、lding JIS Z 3197: 1999, First English edition published in 2000-05 Translated and published by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the original JIS is to be the final authority. O JSA 2000 All rights
8、 reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Printed in Japan Z 3197 : 1999 Contents Page Introduction .
9、1 1 2 3 4 5 6 6.1 6.2 7 7 . 1 7.2 7 . 3 7.4 Scope Normative references Definitions Classification of fluxes and components . Classification of testing methods and types of tests General conditions of tests Standard conditions of tests Test piece Test piece and sample Test materials Reagent Apparatus
10、 and device . Sampling method . 1 1 1 2 2 6 6 6 6 6 6 6 6 7 . 4 . 1 Resin flux cored solder . 6 7.4.2 Solder paste 7 7.4.3 Liquid flux 7 7.4.4 Solid flux . 7 8 Testing methods . 8 8 . 1 Testing of contents 8 8.1.1 Resistivity test of aqueous solution . 8 8.1.2 Flux content test 9 8.1.3 Test of solid
11、 content 10 8.1.4 Activator content test . 11 8.1.4.1 Organic activator content test 11 8.1.4.1.1 Acid value test (resin and organic) . 11 Z 3197 : 1999 8.1.4.1.2 8.1.4.2 Acid value test (aqueous solution) Test of halide activator content 8.1.4.2.1 Potentiometric titration method 8.1.4.2.2 Volhard m
12、ethod (total halide in water-soluble flux) . 8 . 1 . 4 . 2 . 3 Silver chromate paper test (quality of halide) . 8.1.4.2.4 Color reaction method (fluoride content test) . 8.2 Physical characteristic test 8.2.1 Viscosity test 8.2.2 Specific gravity test . 8.2.3 Color number test 8.2.4 Flash point test
13、 8.3 Soldering behavior test . 8.3.1 Flw effect test . 8.3.1.1 Flux expansion method 8.3.1.2 Wetting balance method 8 . 3 . 2 Flux spattering test . 8 . 3 . 2 . 1 8.3.2.2 Flux spattering test of resin flux cored solder Spattering test of liquid flux 8.3.3 Foaming test . 8.4 Corrosion test . 8.4.1 8.
14、4.2 8.5 8 . 5 . 1 8.5.2 Ionic residue test . 8.5.3 Insulation resistance test . 8 . 5 . 4 Voltage-applied moisture resistance test-migration test . Copper plate corrosion test Copper mirror corrosion test . Characteristic test after soldering . Dryness test (evaluation of flux residue viscosity) . A
15、ttached Table 1 Corresponding International Standard Attached Table 2 Normative references . 14 17 17 19 21 23 23 23 24 24 24 24 24 24 26 30 30 31 32 34 34 38 39 39 42 44 47 51 51 JAPANESE INDUSTRIAL STANDARD JIS Z 3197 : 1999 Testing methods for soldering fluxes Introduction This Japanese Industria
16、l Standard specifies the fluxes for soldering used in electronics and communication equipments, etc. The first edition was is- sued in 1972 and then being revised several times afterward. The fluxes for soldering used in electronics implementation require reliable per- formance, quality and reliabil
17、ity after application, and severe quality on products. IS0 specified the testing methods relating to quality included those contents as IS0 9455 Soft soldering fluxes-Test methods, and have established Part-1, 3, 5, 6, 13, 14, 15 in sequence. This Standard is the revised Japanese Industrial Standard
18、 to conform with the International Standard on mainly fluxes for soldering used in electronic and electri- cal equipments, and has added the items not specified in the corresponding Interna- tional Standard. The items, viscosity test, specific gravity test, color number, flashing point test, and foa
19、ming test and ionized residual, are not included in the corresponding stan- dard. 1 Scope This Japanese Industrial Standard specifies the testing method for sol- dering fluxes (hereafter referred to as “flux”) mainly used for wiring electric equip- ments, electronic equipments, communication equipme
20、nts, and parts and components of these equipments. Remarks : The corresponding International Standards to this Standard are listed in Attached Table 1. 2 Normative references The standards shown in the Attached Table 2 contain provisions which, through reference in this text, constitute provisions o
21、f this Stan- dard. The most recent edition of those normative references shall apply. 3 Definitions The main terms in this Standard shall be those specified in JIS Z 3001 and others shall be as follows. resin type flux and activated rosin, etc. The soldering flux based on resin such as rosin (coloph
22、ony) organic type flux The soldering flux based on organic acid. There are two types; one is water-based flux added with various organic activators and the other is alcohol or other solvents based flux added with organic activators. inorganic type flux The fluxes based on water-soluble materials suc
23、h as glyc- erin, polyethylene glycol, polyoxyethylene glycol, etc. and based on non-water- soluble materials such as wax, Vaseline, etc. Those have strong active power by inorganic acid and inorganic salt, but their residuals have strong corrosive- ness. halide content Activator content determined a
24、s chlorine, which is added by mixing or by chemical method to improve solderability of flux. Bromine and iodine also apply. -,-,- STD.JIS Z 3297-ENGL 1777 4933b08 05b3290 937 I 2 Z 3197 : 1999 I 2. Synthetic resin purified water Distilled water and ion exchanged water with specific resis- tivity of
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